| PART |
Description |
Maker |
| 0479890112 47989-0112 |
1.00mm (.039") by 1.00mm (.039") Pitch rPGA 989 Notebook PC CPU Socket, with Mylar, Hard Tray Packaging, 989 Circuits, Lead free
1.00mm (.039) by 1.00mm (.039) Pitch rPGA 989 Notebook PC CPU Socket, with Mylar, Hard Tray Packaging, 989 Circuits, Lead free
|
Molex Electronics Ltd.
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 1-2013297-5 1-2013297-6 |
Memory Sockets; SEMI-HARD TRAY DDR3 204P 8H STD B-L 0.76 ( Tyco Electronics )
Memory Sockets; SEMI-HARD TRAY DDR3 204P 8H STD B-L 0.25 ( Tyco Electronics )
|
Tyco Electronics
|
| 87891-0206 0878910206 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54渭m (100渭) Tin (Sn) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 1-2013290-5 |
Memory Sockets; SEMI-HARD TRAY DDR3 204P 5.2H RVS B-L025 ( Tyco Electronics )
|
Tyco Electronics
|
| 0879143203 87914-3203 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
|
Molex Electronics Ltd.
|
| 0877580816 87758-0816 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879143216 87914-3216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 52830-4412 0528304412 |
Modular Jack, Right Angle, 4/2, 0.10μm (4μ) Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879571010 |
2.50mm (.098) Pitch Header, Right Angle, Through Hole, 10 Circuits, Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
|
